乐泰UF3808 乐泰UF3810 ECCOBOND UF3808 50CC/10CC

Loctite UF3808 Vietnam Loctite UF3810 CHINA

uf3808 Vietnam Loctite UF3808 Vietnam Loctite UF3810 LOCTI UF3811

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UF3810 reworkable epoxy underfill is designed for CSP and

BGA applications. It cures quickly at moderate temperatures to

minimize stress to other components. When cured, this

material provides excellent mechanical properties to

protect solder joints during thermal cycling.

UF3808 capillary underfill is designed to cure quickly at low

temperatures to minimize stress to other components. When

cured, this material provides excellent mechanical properties to

protect solder joints during thermal cycling.

TYPICAL PROPERTIES OF UNCURED MATERIAL UF3838T

Viscosity @ 20 s-1 , Cone and Plate, mPa?s (cP) 360

Specific, 1.16

Pot life @ 25 °C, 25% viscosity increase, days 3

Shelf Life @ -20°C, months 6

Flash Point - See MSDS

LOCTITE ECCOBOND UF3820 UF2801 UF3840